UNE EN IEC 60068-2-20:2021
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads (Endorsed by Asociación Española de Normalización in June of 2021.)
Ensayos ambientales. Parte 2-20: Ensayos. Ensayo T: Métodos de ensayo de soldabilidad y resistencia al calor de soldadura de dispositivos con cables (Ratificada por la Asociación Española de Normalización en junio de 2021.)
| Standard number: | UNE EN IEC 60068-2-20:2021 |
| Pages: | 30 |
| Released: | 2021-06-01 |
| Status: | Standard |
UNE EN IEC 60068-2-20:2021
This part of IEC 60068 outlines Test T, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering. NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance. See IEC 60068-2-69 (solder bath and solder globule method for SMDs).