This document specifies the reflow soldering ability test method components mounted on the organic rigid printed boards, reflow heat resistance test method for the organic rigid printed boards, and reflow soldering ability test method for the organic rigid printed boards land in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheet that be specified in IEC61249-2 series. The objective of this standard is to ensure that the solder joint and the printed boards land soldering ability. In addition, test methods are provided to ensure that the printed boards can resist against the heat load to which it is exposed during soldering. This standard covers tests Tg1, Tg2, Tg3, Tg4, Tg5, and Tg6 as listed Table 1: Table 1 Test items defined in this standard Number of Test method Test Method Tg1 Solder joint initial quality after reflow Tg2 Warpage of component and printed boards in reflow process Tg3 Resistance to soldering heat of printed boards Reflow Tg4 Wetting and dewetting of printed board land Tg5 Resistance to dissolution of printed board land Tg6 Pull strength of the test substrate land NOTE 1 Test methods does not apply to solder bath method