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UNE EN ISO 9455-14:2018
Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
Fundentes para soldeo blando. Métodos de ensayo. Parte 14: Determinación de la adherencia de los residuos de fundente. (ISO 9455-14:2017).
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| Standard number: | UNE EN ISO 9455-14:2018 |
| Pages: | 12 |
| Released: | 2018-03-07 |
| Status: | Standard |
DESCRIPTION
UNE EN ISO 9455-14:2018
This part of ISO 9455 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.