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32693 results
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UNE EN 60127-2:2014
Miniature fuses - Part 2: Cartridge fuse-links (Endorsed by AENOR in January of 2015.)
Released: 2015-01-01
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104.82 USD
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UNE EN 60127-7:2016
Miniature fuses - Part 7: Miniature fuse-links for special applications (Endorsed by AENOR in March of 2016.)
Released: 2016-03-01
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91.88 USD
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UNE EN 60130-9:2011
Connectors for frequencies below 3 MHz - Part 9: Circular connectors for radio and associated sound equipment (Endorsed by AENOR in August of 2011.)
Released: 2011-08-01
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116.47 USD
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UNE EN 60143-2:2013
Series capacitors for power systems - Part 2: Protective equipment for series capacitor banks (Endorsed by AENOR in August of 2013.)
Released: 2013-08-01
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121.65 USD
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UNE EN 60146-2:2000
Semiconductor converters -- Part 2: Self-commutated semiconductor converters including direct d.c. converters (Endorsed by AENOR in December of 2001.)
Released: 2001-12-01
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107.41 USD
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UNE EN 60153-1:2016/AC:2017-02
Hollow metallic waveguides - Part 1: General requirements and measuring methods (Endorsed by Asociación Española de Normalización in March of 2017.)
Released: 2017-03-01
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0.00 USD
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UNE EN 60169-21:1997
RADIO-FREQUENCY CONNECTOR. PART 21: TWO TYPES OF RADIO-FREQUENCY CONNECTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 9,5 MM (0,374 IN) WITH DIFFERENT VERSIONS OF SCREW COUPLING. CHARACTERISTIC IMPENDANCE 50 OHMS (TYPES SC-A AND SC-B). (Endorsed by AENOR in June of 1998.)
Released: 1998-06-01
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UNE EN 60169-25:1993
RADIO-FREQUENCY CONNECTORS. PART 25: TWO-POLO SCREW (3/4-20 UNEF) COUPLED CONNECTORS FOR USE WITH SHIELDED BALANCED CABLES HAVING TWIN INNER CONDUCTORS WITH INNER DIAMETER OF OUTER CONDUCTOR 13,56 MM (0,534 IN) (TYPE TWHN). (Endorsed by AENOR in November of 1995.)
Released: 1995-11-01
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UNE EN 60191-4:2014/A1:2018
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
Released: 2018-06-01
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UNE EN 60191-6-13:2016
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
Released: 2017-01-01
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84.12 USD
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UNE EN 60191-6-18:2010
Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)
Released: 2010-05-01
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UNE EN 60191-6-19:2010
Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Released: 2010-09-01
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32693 results
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