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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>18/30375624 DC BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
immediate downloadReleased: 2018-07-13
18/30375624 DC BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

18/30375624 DC

BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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Standard number:18/30375624 DC
Pages:39
Released:2018-07-13
Status:Draft for Comment
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18/30375624 DC


This standard 18/30375624 DC BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

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