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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>23/30469486 DC BS EN IEC 63378-2. Thermal standardization on semiconductor packages Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
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immediate downloadReleased: 2023-02-07
23/30469486 DC BS EN IEC 63378-2. Thermal standardization on semiconductor packages Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis

23/30469486 DC

BS EN IEC 63378-2. Thermal standardization on semiconductor packages Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis

CURRENCY
24 EUR
Standard number:23/30469486 DC
Pages:18
Released:2023-02-07
Status:Draft for Comment
DESCRIPTION

23/30469486 DC


This standard 23/30469486 DC BS EN IEC 63378-2. Thermal standardization on semiconductor packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
  • 31.080.01 Semiconductor devices in general

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