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31.080.01 Semiconductor devices in general
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13/30264591 DC
BS EN 60747-14-6. Semiconductor devices. Part 14-6. Semiconductor sensor. Humidity sensor
BS EN 60747-14-6. Semiconductor devices. Part 14-6. Semiconductor sensor. Humidity sensor
Released: 2013-06-19
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13/30264596 DC
BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
BS EN 60747-14-7. Semiconductor devices. Part 14-7. Semiconductor sensor. Flow meter
Released: 2013-06-19
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13/30264600 DC
BS EN 60747-14-8. Semiconductor devices. Part 14-8. Semiconductor sensors. Capacitive degradation sensor of liquid
BS EN 60747-14-8. Semiconductor devices. Part 14-8. Semiconductor sensors. Capacitive degradation sensor of liquid
Released: 2013-06-19
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13/30284029 DC
BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
BS EN 60191-6-16. Mechanical standardization of semiconductor devices. Part 6-16. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Released: 2013-05-08
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13/30290462 DC
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
BS EN 60191-1. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
Released: 2013-09-10
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13/30290470 DC
BS EN 60191-2/F71. Proposed new package outline. P-ZMP-P89
BS EN 60191-2/F71. Proposed new package outline. P-ZMP-P89
Released: 2013-09-11
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18/30383935 DC
BS EN IEC 62047-37. Semiconductor devices. Micro-electromechanical devices Part 37. Environmental test methods of MEMS piezoelectric thin films for sensor application
BS EN IEC 62047-37. Semiconductor devices. Micro-electromechanical devices Part 37. Environmental test methods of MEMS piezoelectric thin films for sensor application
Released: 2018-12-04
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25.55 USD
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22/30443234 DC
BS EN 63378-3. Thermal standardization on semiconductor packages Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
BS EN 63378-3. Thermal standardization on semiconductor packages Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
Released: 2022-01-24
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22/30443678 DC
BS EN 60749-34-1. Semiconductor devices. Mechanical and climatic test methods Part 34-1. Power cycling test for power semiconductor module
BS EN 60749-34-1. Semiconductor devices. Mechanical and climatic test methods Part 34-1. Power cycling test for power semiconductor module
Released: 2022-03-30
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