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31.080.01 Semiconductor devices in general
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25.55 USD
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21/30427709 DC
BS IEC 63287-2. Semiconductor devices. Guidelines for reliability qualification plans Part 2. Concept of mission profile
BS IEC 63287-2. Semiconductor devices. Guidelines for reliability qualification plans Part 2. Concept of mission profile
Released: 2021-02-09
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22/30443234 DC
BS EN 63378-3. Thermal standardization on semiconductor packages Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
BS EN 63378-3. Thermal standardization on semiconductor packages Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
Released: 2022-01-24
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22/30443678 DC
BS EN 60749-34-1. Semiconductor devices. Mechanical and climatic test methods Part 34-1. Power cycling test for power semiconductor module
BS EN 60749-34-1. Semiconductor devices. Mechanical and climatic test methods Part 34-1. Power cycling test for power semiconductor module
Released: 2022-03-30
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23/30469486 DC
BS EN IEC 63378-2. Thermal standardization on semiconductor packages Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
BS EN IEC 63378-2. Thermal standardization on semiconductor packages Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis
Released: 2023-02-07
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23/30472390 DC
BS EN 60747-16-11 Semiconductor devices Part 16-11. Microwave integrated circuits - Power detectors
BS EN 60747-16-11 Semiconductor devices Part 16-11. Microwave integrated circuits - Power detectors
Released: 2023-04-04
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23/30473272 DC
BS IEC 60747-5-4 AMD 1. Semiconductor devices Part 5-4. Optoelectronic devices. Semiconductor lasers
BS IEC 60747-5-4 AMD 1. Semiconductor devices Part 5-4. Optoelectronic devices. Semiconductor lasers
Released: 2023-04-26
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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
Released: 1997-09-15
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296.45 USD
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BS 7241:1989
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
Released: 1990-03-30
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454.89 USD
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454.89 USD
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253.00 USD
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253.00 USD
BS EN 60068-2-13:1999
Environmental testing. Test methods Tests. Test M. Low air pressure
Environmental testing. Test methods Tests. Test M. Low air pressure
Released: 1999-09-15
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153.34 USD
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