Log inSign up
LANGUAGE en
Menu
STOREABOUT US Help centerContactsDelivery chargesNews
SEARCH
0
Total price
0 USD
PRICES include / exclude VAT
Homepage>BS Standards>01 GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION>01.100 Technical drawings>01.100.25 Electrical and electronics engineering drawings>BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)
Sponsored link
immediate downloadReleased: 2001-05-15
BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

BS EN 60191-6-3:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

Format
Availability
Price and currency
English Secure PDF
Immediate download
195.00 USD
English Hardcopy
In stock
195.00 USD
Standard number:BS EN 60191-6-3:2001
Pages:20
Released:2001-05-15
ISBN:0 580 37243 X
Status:Standard
DESCRIPTION

BS EN 60191-6-3:2001


This standard BS EN 60191-6-3:2001 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
  • 01.100.25 Electrical and electronics engineering drawings

Print