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31.080.01 Semiconductor devices in general
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BS EN 60749-9:2017
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Released: 2017-11-27
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189.18 USD
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189.18 USD
BS EN 60749-44:2016
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Semiconductor devices. Mechanical and climatic test methods Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
Released: 2016-11-30
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310.59 USD
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310.59 USD
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223.06 USD
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223.06 USD
BS IEC 60747-9:2019
Semiconductor devices Discrete devices. Insulated-gate bipolar transistors (IGBTs)
Semiconductor devices Discrete devices. Insulated-gate bipolar transistors (IGBTs)
Released: 2019-11-22
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BS IEC 60747-14-2:2000
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors Hall elements
Released: 2001-05-15
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BS EN 60749-23:2004+A1:2011
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Semiconductor devices. Mechanical and climatic test methods High temperature operating life
Released: 2011-06-30
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BS EN 60749-27:2006+A1:2012
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Released: 2013-01-31
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BS EN 60749-21:2011
Semiconductor devices. Mechanical and climatic test methods Solderability
Semiconductor devices. Mechanical and climatic test methods Solderability
Released: 2011-08-31
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PD ES 59008-5-3:2001
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Data requirements for semiconductor die. Particular requirements and recommendations for die types Minimally-packaged die
Released: 2001-12-05
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BS EN 60749-34:2010
Semiconductor devices. Mechanical and climatic test methods Power cycling
Semiconductor devices. Mechanical and climatic test methods Power cycling
Released: 2011-02-28
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BS IEC 62951-5:2019
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Semiconductor devices. Flexible and stretchable semiconductor devices Test method for thermal characteristics of flexible materials
Released: 2019-03-05
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223.06 USD
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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions
Mechanical standardization of semiconductor devices Dimensions
Released: 2020-04-02
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465.88 USD
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