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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS 3934-5:1997 Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits
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immediate downloadReleased: 1997-09-15
BS 3934-5:1997 Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

BS 3934-5:1997

Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

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Standard number:BS 3934-5:1997
Pages:38
Released:1997-09-15
ISBN:0 580 27812 3
Status:Standard
DESCRIPTION

BS 3934-5:1997


This standard BS 3934-5:1997 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).