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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>24/30502907 DC BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
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immediate downloadReleased: 2024-12-13
24/30502907 DC BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods

24/30502907 DC

BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods

CURRENCY
22.4 EUR
Standard number:24/30502907 DC
Pages:34
Released:2024-12-13
Status:Draft for Comment
DESCRIPTION

24/30502907 DC


This standard 24/30502907 DC BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

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