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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>25/30510059 DC BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
immediate downloadReleased: 2025-02-07
25/30510059 DC BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

25/30510059 DC

BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

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Standard number:25/30510059 DC
Pages:29
Released:2025-02-07
Status:Draft for Comment
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25/30510059 DC


This standard 25/30510059 DC BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

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