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>BSI Standards >31 ELECTRONICS>31.190 Electronic component assemblies>26/30511918 DC Draft BS EN 62878-2-604 Ed.1.0 Device embedding assembly technology Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module
immediate downloadReleased: 2026-04-15
26/30511918 DC Draft BS EN 62878-2-604 Ed.1.0 Device embedding assembly technology Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

26/30511918 DC

Draft BS EN 62878-2-604 Ed.1.0 Device embedding assembly technology Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

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Standard number:26/30511918 DC
Pages:15
Released:2026-04-15
Status:Draft for Comment
DESCRIPTION

26/30511918 DC


This standard 26/30511918 DC Draft BS EN 62878-2-604 Ed.1.0 Device embedding assembly technology is classified in these ICS categories:
  • 31.190 Electronic component assemblies

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