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Main page>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>26/30566055 DC BS EN IEC 61249-2-56 Materials for printed boards and other interconnecting structure Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
immediate downloadReleased: 2026-07-03
26/30566055 DC BS EN IEC 61249-2-56 Materials for printed boards and other interconnecting structure Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

26/30566055 DC

BS EN IEC 61249-2-56 Materials for printed boards and other interconnecting structure Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

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Standard number:26/30566055 DC
Pages:27
Released:2026-07-03
Status:Draft for Comment
DESCRIPTION

26/30566055 DC


This standard 26/30566055 DC BS EN IEC 61249-2-56 Materials for printed boards and other interconnecting structure is classified in these ICS categories:
  • 31.180 Printed circuits and boards

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