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Main page>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>26/30568358 DC BS IEC 62047-63 Semiconductor devices - Micro-electromechanical systems Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading
immediate downloadReleased: 2026-07-31
26/30568358 DC BS IEC 62047-63 Semiconductor devices - Micro-electromechanical systems Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading

26/30568358 DC

BS IEC 62047-63 Semiconductor devices - Micro-electromechanical systems Part 63: Tensile test method for shape-memory characteristics of MEMS materials under thermomechanical loading

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Standard number:26/30568358 DC
Pages:17
Released:2026-07-31
Status:Draft for Comment
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26/30568358 DC


This standard 26/30568358 DC BS IEC 62047-63 Semiconductor devices - Micro-electromechanical systems is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices