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Main page>BSI Standards >31 ELECTRONICS>31.180 Printed circuits and boards>26/30570647 DC BS EN IEC 61249-3-9 Materials for circuit boards and other interconnecting structures Part 3-9. Sectional specification set for unreinforced base materials, clad and unclad. Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
immediate downloadReleased: 2026-09-04
26/30570647 DC
BS EN IEC 61249-3-9 Materials for circuit boards and other interconnecting structures Part 3-9. Sectional specification set for unreinforced base materials, clad and unclad. Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
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Standard number:
26/30570647 DC
Pages:
23
Released:
2026-09-04
Status:
Draft for Comment
DESCRIPTION
26/30570647 DC
This standard 26/30570647 DC BS EN IEC 61249-3-9 Materials for circuit boards and other interconnecting structures is classified in these ICS categories:
