PRICES include / exclude VAT
Homepage>ASTM Standards>29>29.035>29.035.50>ASTM D0352-23 - Standard Test Methods for Pasted Mica Used in Electrical Insulation
Released: 01.08.2023

ASTM D0352-23 - Standard Test Methods for Pasted Mica Used in Electrical Insulation

Standard Test Methods for Pasted Mica Used in Electrical Insulation

Format
Availability
Price and currency
English PDF Redline
Immediate download
72.76 USD
English PDF
Immediate download
60.99 USD
English Hardcopy
In stock
60.99 USD
Standard number:D0352-23
Released:01.08.2023
Status:Active
Pages:6
Section:10.01
Keywords:binder content; bonded mica paper; bonded mica splittings; commutator segment insulation; compressive creep; heater plates; pasted mica ;
DESCRIPTION

1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.

1.2 These test methods appear in the following sections:

Test

Sections

Compressive Creep

4 – 10

Dielectric Strength

38 – 41

Mica or Binder Content

19

Molding Test

31 – 36

Organic Binder

20 – 24

Resistivity

42 – 46

Silicone Binder

25 – 30

Stability Under Heat and Pressure

11 – 18

1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.

1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.