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Homepage>ASTM Standards>17>17.040>17.040.20>ASTM E2382-04R20 - Standard Guide to Scanner and Tip Related Artifacts in Scanning Tunneling Microscopy and Atomic Force Microscopy
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Released: 01.12.2020

ASTM E2382-04R20 - Standard Guide to Scanner and Tip Related Artifacts in Scanning Tunneling Microscopy and Atomic Force Microscopy

Standard Guide to Scanner and Tip Related Artifacts in Scanning Tunneling Microscopy and Atomic Force Microscopy

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Standard number:ASTM E2382-04R20
Released:01.12.2020
Status:Active
Pages:20
Section:03.06
Keywords:Abbe offset error; creep; dilation; hysteresis; nonlinearity; probe-sample mixing; AFM; STM; tip shape; proximal probe; geometric mixing; image reconstruction;
DESCRIPTION

1.1 All microscopes are subject to artifacts. The purpose of this document is to provide a description of commonly observed artifacts in scanning tunneling microscopy (STM) and atomic force microscopy (AFM) relating to probe motion and geometric considerations of the tip and surface interaction, provide literature references of examples and, where possible, to offer an interpretation as to the source of the artifact. Because the scanned probe microscopy field is a burgeoning one, this document is not meant to be comprehensive but rather to serve as a guide to practicing microscopists as to possible pitfalls one may expect. The ability to recognize artifacts should assist in reliable evaluation of instrument operation and in reporting of data.

1.2 A limited set of terms will be defined here. A full description of terminology relating to the description, operation, and calibration of STM and AFM instruments is beyond the scope of this document.

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.