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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
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BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

BS 4584-103.2:1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

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Standard number:BS 4584-103.2:1990
Pages:14
Released:1990-02-28
ISBN:0 580 18190 1
Status:Standard
DESCRIPTION

BS 4584-103.2:1990


This standard BS 4584-103.2:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits is classified in these ICS categories:
  • 31.180 Printed circuits and boards

This specification gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used for printed wiring.

This specification applies to copper foil supplied in rolls, but by agreement between purchaser and vendor, may be applied to foil produced in sheets.


For use in the manufacture of copper clad laminated sheets and of copper clad flexible materials used for printed wiring.