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31.180 Printed circuits and boards
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223.06 USD
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223.06 USD
BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology
Released: 2002-06-21
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310.59 USD
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310.59 USD
PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)
Device embedded substrate Guidelines. Test element groups (TEG)
Released: 2015-04-30
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364.24 USD
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364.24 USD
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223.06 USD
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223.06 USD
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223.06 USD
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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Released: 1998-08-15
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364.24 USD
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BS EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Released: 2006-07-31
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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Released: 2014-05-07
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465.88 USD
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465.88 USD
English Secure PDF
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310.59 USD
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310.59 USD
BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Released: 2008-07-31
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English Secure PDF
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310.59 USD
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310.59 USD
BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Released: 1997-05-15
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223.06 USD
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