31.180 Printed circuits and boards
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Price include VAT will be charged for customers of European Union – non VAT payers.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
Price exclude VAT will be charged for customers of European Union – VAT payers (with valid EU VAT number) and for customers outside of European Union.
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Released: 2017-11-22
BS IEC 62899-402-2. Printed Electronics Part 402-2. Printability. Measurement of qualitities. Edge waviness
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Released: 2017-07-05
BS IEC 61188-6-4. Printed boards and printed board assemblies. Design and use Part 6-4. Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design
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Released: 2017-09-01
BS IEC 60194-1. Printed boards design, manufacture and assembly. Vocabulary. Part 1. Common usage in printed board and electronic assembly technologies
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Released: 2017-10-05
BS EN 16602-70-60. Space product assurance. Qualification and Procurement of printed circuit boards
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Released: 2018-05-29
BS IEC 62899-101. Printed Electronics Part 101. Terminology. Vocabulary
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Released: 2018-08-01
BS IEC 62878-2-5. Device embedded substrate Part 2-5. Implementation of a 3D data format for device embedded substrate
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Released: 2018-04-04
BS IEC 62878-1. Device embedded substrate Part 1. Generic specification
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Released: 2018-07-13
BS EN IEC 62899-204. Printed electronics Part 204. Materials. Insulator ink
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Released: 2018-03-27
BS EN 62899-202-4. Printed electronics Part 202-4. Materials. Evaluation method of stretchable functional ink (conductive ink and insulator layer)
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Released: 2018-04-24
BS EN 62899-202-6. Printed electronics Part 202-6. Materials. Conductive film. Environmental test of a printed metal based conductive layer on flexible substrate
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Released: 2018-05-09
BS EN 62899-202-7. Printed electronics Part 202-7. Materials. Conductive ink. Measurement of peel strength for printed conductive layer on flexible substrate
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Released: 2018-11-21
BS EN IEC 61189-2-801. Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 2-801. Thermal conductivity test for base materials