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310.59 USD
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BS EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies
Released: 2006-09-29
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364.24 USD
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409.41 USD
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409.41 USD
BS IEC 62899-303-1:2018
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
Released: 2018-05-18
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189.18 USD
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189.18 USD
PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Released: 2019-04-01
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223.06 USD
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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
Released: 2021-08-20
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Released: 2021-03-25
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BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
Device embedding assembly technology Generic specification for device embedded substrates
Released: 2019-12-17
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BS IEC 62899-202-4:2021
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Released: 2021-12-24
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Printed electronics Material technologies required in printed electronics for wearable smart devices
Released: 2025-03-17
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BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)
Released: 2025-02-04
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