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31.180 Printed circuits and boards

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Released: 2009-07-31
BS EN 62496-1:2009
Optical circuit boards General
LANGUAGE
English
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Released: 2010-06-30
BS EN 62496-3-1:2010
Optical circuit boards. Performance standard Flexible optical circuit boards using unconnectorized optical glass fibres
LANGUAGE
English
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Released: 2011-03-31
BS EN 62496-3:2011
Optical circuit boards Performance standards. General and guidance
LANGUAGE
English
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Released: 2011-03-31
BS EN 62496-4:2011
Optical circuit boards Interface standards. General and guidance
LANGUAGE
English
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Released: 2015-07-31
BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods
LANGUAGE
English
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Released: 2021-03-19
BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
LANGUAGE
English
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Released: 2019-07-12
BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
LANGUAGE
English
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Released: 2018-10-10
BS EN IEC 61189-2-630:2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
LANGUAGE
English
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Released: 2021-03-12
BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes
LANGUAGE
English
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Released: 2021-03-18
BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
LANGUAGE
English
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Released: 2018-04-13
BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
LANGUAGE
English
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Released: 2020-06-17
BS EN IEC 61189-5-504:2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Process ionic contamination testing (PICT)
LANGUAGE
English