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31.180 Printed circuits and boards

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Released: 2021-03-19
BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
LANGUAGE
English
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Released: 2020-02-27
BS EN IEC 61191-1:2018 - TC
Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
LANGUAGE
English
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Released: 2018-11-13
BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
LANGUAGE
English
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Released: 2018-04-13
BS EN IEC 61249-2-45:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
LANGUAGE
English
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Released: 2018-04-16
BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
LANGUAGE
English
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Released: 2018-04-18
BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
LANGUAGE
English
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Released: 2019-12-17
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
LANGUAGE
English
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Released: 2019-11-18
BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate
LANGUAGE
English
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Released: 2019-01-03
BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates
LANGUAGE
English
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Released: 2019-01-23
BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method
LANGUAGE
English
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Released: 2018-10-09
BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
LANGUAGE
English
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Released: 2020-12-11
BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate
LANGUAGE
English