31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Tracked Changes. Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Device embedding assembly technology Generic specification for device embedded substrates

Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate

Printed electronics Materials. Substrates

Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method

Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate