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31.180 Printed circuits and boards

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Released: 2017-11-16
BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
LANGUAGE
English
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Released: 2018-05-18
BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
LANGUAGE
English
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Released: 2018-05-18
BS IEC 62899-303-1:2018
Printed electronics Equipment. Roll-to-roll printing. Mechanical dimensions
LANGUAGE
English
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Released: 2017-03-31
BS IEC 62899-401:2017
Printed electronics Printability. Overview
LANGUAGE
English
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Released: 2017-03-31
BS IEC 62899-402-1:2017
Printed electronics Printability. Measurement of qualities. Pattern width
LANGUAGE
English
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Released: 2020-09-04
BS IEC 62899-402-2:2020
Printed electronics Printability. Measurement of qualities. Edge waviness
LANGUAGE
English
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Released: 2021-04-22
BS IEC 62899-402-3:2021
Printed electronics Printability. Measurement of qualities. Voids in printed pattern using a two-dimensional optical image
LANGUAGE
English
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Released: 2018-06-27
BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
LANGUAGE
English
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Released: 2016-11-30
BS IEC 63055:2016
Format for LSI-Package-Board interoperable design
LANGUAGE
English
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Released: 2007-10-31
DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
LANGUAGE
English
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Released: 2011-11-30
DD IEC/PAS 61249-6-3:2011
Specification for finished fabric woven from “E” glass for printed boards
LANGUAGE
English
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Released: 2010-11-30
DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide
LANGUAGE
English