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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
immediate downloadReleased: 2023-12-25
BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

BS EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

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Standard number:BS EN IEC 61189-2-801:2023
Pages:16
Released:2023-12-25
ISBN:978 0 539 28571 0
Status:Corrigendum
DESCRIPTION

BS EN IEC 61189-2-801:2023


This standard BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
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