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Homepage>BS Standards>61 CLOTHING INDUSTRY>61.060 Footwear>BS 5131-1.3:1991 Methods of test for footwear and footwear materials. Adhesives Preparation of test assemblies using adhesives (other than hot melt adhesives) for heat resistance (creep) and peel tests
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immediate downloadReleased: 1991-02-28
BS 5131-1.3:1991 Methods of test for footwear and footwear materials. Adhesives Preparation of test assemblies using adhesives (other than hot melt adhesives) for heat resistance (creep) and peel tests

BS 5131-1.3:1991

Methods of test for footwear and footwear materials. Adhesives Preparation of test assemblies using adhesives (other than hot melt adhesives) for heat resistance (creep) and peel tests

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Standard number:BS 5131-1.3:1991
Pages:18
Released:1991-02-28
ISBN:0 580 18683 0
Status:Standard
DESCRIPTION

BS 5131-1.3:1991


This standard BS 5131-1.3:1991 Methods of test for footwear and footwear materials. Adhesives is classified in these ICS categories:
  • 83.180 Adhesives
  • 61.060 Footwear

This Section of BS 5131 describes methods for preparation of the test assemblies required by Sections 1.1 and 1.2 for determination, respectively, of the resistance of bonded joints to heat (creep test) and to peeling. This Section includes methods for preparation of the adhesive and of the adherends. It covers most types of bonding used in the footwear industry except hot melt adhesive bonds which are covered in Section 1.7.

The types of bond include stuck-on bonds made by the use of applied adhesives (both solvent-based and water-based), injected-on bonds using thermoplastic sole materials, e.g. polyvinylchloride (PVC), thermoplastic rubber, and moulded-on direct vulcanized rubber sole bonds. The methods of preparation are applicable to a wide variety of combinations of materials, but the peel and creep tests of Sections 1.1 and 1.2 require at least one adherend to be flexible.

NOTE The titles of the publications referred to in this standard are listed on the inside back cover.


Methods for preparation of test assemblies required by Sections 1.1 and 1.2.