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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
immediate downloadReleased: 2010-10-31
BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

BS EN 60191-6-18:2010

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

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Standard number:BS EN 60191-6-18:2010
Pages:24
Released:2010-10-31
ISBN:978 0 580 71947 9
Status:Standard
DESCRIPTION

BS EN 60191-6-18:2010


This standard BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.


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