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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
immediate downloadReleased: 2003-12-15
BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

BS EN 60749-14:2003

Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

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Standard number:BS EN 60749-14:2003
Pages:18
Released:2003-12-15
ISBN:0 580 43082 0
Status:Standard
DESCRIPTION

BS EN 60749-14:2003


This standard BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
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