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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)
immediate downloadReleased: 2004-06-24
BS EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)

BS EN 60749-16:2003

Semiconductor devices. Mechanical and climatic test methods Particle impact noise detection (PIND)

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Standard number:BS EN 60749-16:2003
Pages:10
Released:2004-06-24
ISBN:0 580 42062 0
Status:Standard
DESCRIPTION

BS EN 60749-16:2003


This standard BS EN 60749-16:2003 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
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