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Homepage>BS Standards>29 ELECTRICAL ENGINEERING>29.100 Components for electrical equipment>29.100.10 Magnetic components>BS EN 60749-22:2003 Semiconductor devices. Mechanical and climatic test methods Bond strength
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immediate downloadReleased: 2003-07-04
BS EN 60749-22:2003 Semiconductor devices. Mechanical and climatic test methods Bond strength

BS EN 60749-22:2003

Semiconductor devices. Mechanical and climatic test methods Bond strength

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Standard number:BS EN 60749-22:2003
Pages:24
Released:2003-07-04
ISBN:0 580 42199 6
Status:Standard
DESCRIPTION

BS EN 60749-22:2003


This standard BS EN 60749-22:2003 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 29.100.10 Magnetic components
  • 31.080.01 Semiconductor devices in general
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.