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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN 60749-35:2006 Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components
immediate downloadReleased: 2006-11-30
BS EN 60749-35:2006 Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components

BS EN 60749-35:2006

Semiconductor devices. Mechanical and climatic test methods Acoustic microscopy for plastic encapsulated electronic components

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Standard number:BS EN 60749-35:2006
Pages:24
Released:2006-11-30
ISBN:0 580 49739 9
Status:Standard
DESCRIPTION

BS EN 60749-35:2006


This standard BS EN 60749-35:2006 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
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