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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>BS EN 62047-2:2006 Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials
immediate downloadReleased: 2006-11-30
BS EN 62047-2:2006 Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials

BS EN 62047-2:2006

Semiconductor devices. Micro-electromechanical devices Tensile testing method of thin film materials

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Standard number:BS EN 62047-2:2006
Pages:16
Released:2006-11-30
ISBN:0 580 49740 2
Status:Standard
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BS EN 62047-2:2006


This standard BS EN 62047-2:2006 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.