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immediate downloadReleased: 2013-01-31
BS EN 62047-9:2011
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
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| Standard number: | BS EN 62047-9:2011 |
| Pages: | 30 |
| Released: | 2013-01-31 |
| ISBN: | 978 0 580 78793 5 |
| Status: | Corrigendum |
DESCRIPTION
BS EN 62047-9:2011
This standard BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
- 31.080.99 Other semiconductor devices
This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 µm to several millimeters.