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>BSI Standards >31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN IEC 60749-23:2026 Semiconductor devices. Mechanical and climatic test methods High temperature operating life
immediate downloadReleased: 2026-02-03
BS EN IEC 60749-23:2026 Semiconductor devices. Mechanical and climatic test methods High temperature operating life

BS EN IEC 60749-23:2026

Semiconductor devices. Mechanical and climatic test methods High temperature operating life

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Standard number:BS EN IEC 60749-23:2026
Pages:14
Released:2026-02-03
ISBN:978 0 539 35726 4
Status:Standard
DESCRIPTION

BS EN IEC 60749-23:2026


This standard BS EN IEC 60749-23:2026 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60749-23:2025 specifies the test used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as "burn-in", can be used to screen for infant-mortality related failures. The detailed use and application of burn-in is outside the scope of this document. This edition includes the following significant technical changes with respect to the previous edition: a) absolute stress test definitions and resultant test durations have been updated.