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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61188-6-1:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards
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immediate downloadReleased: 2021-04-07
BS EN IEC 61188-6-1:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

BS EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

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Standard number:BS EN IEC 61188-6-1:2021
Pages:36
Released:2021-04-07
ISBN:978 0 580 99718 1
Status:Standard
DESCRIPTION

BS EN IEC 61188-6-1:2021


This standard BS EN IEC 61188-6-1:2021 Circuit boards and circuit board assemblies. Design and use is classified in these ICS categories:
  • 31.190 Electronic component assemblies
  • 31.180 Printed circuits and boards
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
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