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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61188-6-2:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
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immediate downloadReleased: 2021-03-19
BS EN IEC 61188-6-2:2021 Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

BS EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

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Standard number:BS EN IEC 61188-6-2:2021
Pages:32
Released:2021-03-19
ISBN:978 0 539 05928 1
Status:Standard
DESCRIPTION

BS EN IEC 61188-6-2:2021


This standard BS EN IEC 61188-6-2:2021 Circuit boards and circuit board assemblies. Design and use is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.
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