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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
immediate downloadReleased: 2023-09-13
BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

BS EN IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

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Standard number:BS EN IEC 61189-2-803:2023
Pages:14
Released:2023-09-13
ISBN:978 0 539 01306 1
Status:Standard

BS EN IEC 61189-2-803:2023 - The Ultimate Guide for Testing Electrical Materials, Printed Boards, and Other Interconnection Structures and Assemblies

Introducing the BS EN IEC 61189-2-803:2023, a comprehensive standard that provides detailed test methods for electrical materials, printed boards, and other interconnection structures and assemblies. This standard is specifically designed to guide you through the process of testing the Z-axis expansion of base materials and printed boards. With its release on 13th September 2023, it is the most up-to-date and relevant standard in the industry.

Key Features

The BS EN IEC 61189-2-803:2023 standard is a 14-page document that is packed with valuable information and guidelines. It is meticulously organized and easy to navigate, making it a user-friendly resource for professionals in the field. The standard is available in a digital format with an ISBN of 978 0 539 01306 1, ensuring its authenticity and credibility.

Why Choose BS EN IEC 61189-2-803:2023?

As a professional in the field of electrical materials and printed boards, you understand the importance of accurate and reliable testing methods. The BS EN IEC 61189-2-803:2023 standard provides you with a comprehensive set of test methods that are designed to ensure the highest level of accuracy and reliability. These methods are specifically designed to test the Z-axis expansion of base materials and printed boards, a critical aspect of ensuring the quality and performance of these materials.

Benefits of Using BS EN IEC 61189-2-803:2023

By using the BS EN IEC 61189-2-803:2023 standard, you can ensure that your testing methods are in line with the latest industry standards. This can help to improve the quality of your products, increase customer satisfaction, and enhance your reputation in the industry. Furthermore, by adhering to this standard, you can demonstrate your commitment to quality and professionalism, which can help to attract new customers and retain existing ones.

Who Should Use BS EN IEC 61189-2-803:2023?

The BS EN IEC 61189-2-803:2023 standard is suitable for a wide range of professionals in the field of electrical materials and printed boards. This includes manufacturers, engineers, quality control professionals, and researchers. Whether you are a seasoned professional or a newcomer to the field, this standard can provide you with the guidance and information you need to conduct accurate and reliable tests.

Conclusion

In conclusion, the BS EN IEC 61189-2-803:2023 standard is an invaluable resource for professionals in the field of electrical materials and printed boards. It provides a comprehensive set of test methods for the Z-axis expansion of base materials and printed boards, ensuring the highest level of accuracy and reliability. With its user-friendly format and up-to-date information, it is a must-have resource for anyone involved in the testing of these materials.

Don't miss out on this opportunity to enhance your testing methods and improve the quality of your products. Get your copy of the BS EN IEC 61189-2-803:2023 standard today!

DESCRIPTION

BS EN IEC 61189-2-803:2023


This standard BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).