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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
immediate downloadReleased: 2023-12-25
BS EN IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300

BS EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300

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Standard number:BS EN IEC 61189-2-804:2023
Pages:14
Released:2023-12-25
ISBN:978 0 539 29807 9
Status:Corrigendum
DESCRIPTION

BS EN IEC 61189-2-804:2023


This standard BS EN IEC 61189-2-804:2023 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
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