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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA
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BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

BS EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Decomposition temperature (<i>T</i><sub>d</sub>) using TGA

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Standard number:BS EN IEC 61189-2-807:2021
Pages:14
Released:2021-11-05
ISBN:978 0 539 12605 1
Status:Standard
DESCRIPTION

BS EN IEC 61189-2-807:2021


This standard BS EN IEC 61189-2-807:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 35.100.01 Open systems interconnection in general