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immediate downloadReleased: 2019-12-17
BS EN IEC 62878-1:2019
Device embedding assembly technology Generic specification for device embedded substrates
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Standard number: | BS EN IEC 62878-1:2019 |
Pages: | 26 |
Released: | 2019-12-17 |
ISBN: | 978 0 580 97304 8 |
Status: | Standard |
DESCRIPTION
BS EN IEC 62878-1:2019
This standard BS EN IEC 62878-1:2019 Device embedding assembly technology is classified in these ICS categories:
- 31.190 Electronic component assemblies
- 31.180 Printed circuits and boards
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.