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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 62878-1:2019 Device embedding assembly technology Generic specification for device embedded substrates
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immediate downloadReleased: 2019-12-17
BS EN IEC 62878-1:2019 Device embedding assembly technology Generic specification for device embedded substrates

BS EN IEC 62878-1:2019

Device embedding assembly technology Generic specification for device embedded substrates

CURRENCY
LANGUAGE
English
Standard number:BS EN IEC 62878-1:2019
Pages:26
Released:2019-12-17
ISBN:978 0 580 97304 8
Status:Standard
DESCRIPTION
This standard BS EN IEC 62878-1:2019 Device embedding assembly technology is classified in these ICS categories:
  • 31.190 Electronic component assemblies
  • 31.180 Printed circuits and boards
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
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