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Homepage>BS Standards>31 ELECTRONICS>31.180 Printed circuits and boards>BS EN IEC 62878-2-602:2021 Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity
immediate downloadReleased: 2021-08-20
BS EN IEC 62878-2-602:2021 Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

BS EN IEC 62878-2-602:2021

Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

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Standard number:BS EN IEC 62878-2-602:2021
Pages:18
Released:2021-08-20
ISBN:978 0 539 04645 8
Status:Standard
DESCRIPTION

BS EN IEC 62878-2-602:2021


This standard BS EN IEC 62878-2-602:2021 Device embedding assembly technology is classified in these ICS categories:
  • 31.180 Printed circuits and boards
  • 31.190 Electronic component assemblies
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
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