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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.99 Other semiconductor devices>BS IEC 62047-38:2021 Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
immediate downloadReleased: 2021-07-07
BS IEC 62047-38:2021 Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection

BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection

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Standard number:BS IEC 62047-38:2021
Pages:16
Released:2021-07-07
ISBN:978 0 539 06751 4
Status:Standard
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BS IEC 62047-38:2021


This standard BS IEC 62047-38:2021 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices