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immediate downloadReleased: 2019-01-24
BS IEC 63011-2:2018
Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect
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195.00 USD
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Standard number: | BS IEC 63011-2:2018 |
Pages: | 18 |
Released: | 2019-01-24 |
ISBN: | 978 0 580 97375 8 |
Status: | Standard |
DESCRIPTION
BS IEC 63011-2:2018
This standard BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:
- 31.200 Integrated circuits. Microelectronics