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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3587 Semiconductor elements>CSN EN 60191-6-19 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Released: 01.12.2010
CSN EN 60191-6-19 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

CSN EN 60191-6-19

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

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Number of Standard:CSN EN 60191-6-19
Category:358791
Pages:28
Released:01.12.2010
Catalog number:87285
DESCRIPTION

CSN EN 60191-6-19

CSN EN 60191-6-19 Tato norma určuje měřicí metody pro měření zprohýbání pouzdra při zvýšené teplotě a maximální dovolený průhyb pro pouzdra BGA, FBGA a FLGA.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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