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Homepage>BS Standards>31 ELECTRONICS>31.080 Semiconductor devices>31.080.01 Semiconductor devices in general>BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

immediate downloadReleased: 2013-04-30

BS EN 60191-6-22:2013

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

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Standard number:	BS EN 60191-6-22:2013
Pages:	20
Released:	2013-04-30
ISBN:	978 0 580 75720 4
Status:	Standard

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BS EN 60191-6-22:2013

This standard BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices is classified in these ICS categories:

31.080.01 Semiconductor devices in general

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

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