PRICES include / exclude VAT
Sponsored link
FREE SHIPPINGReleased: 2003
CSN EN 61188-5-2
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
CURRENCY
| Category: | 359038 |
| Released: | 2003 |
| Number of Standard: | CSN EN 61188-5-2 |
DESCRIPTION
EN 61188-5-2
EN 61188-5-2 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components - Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
This product includes:
Related products
FREE SHIPPING
Released: 2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008)
FREE SHIPPING
Released: 2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-38:2008)
FREE SHIPPING
Released: 2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35:2008)
FREE SHIPPING
Released: 2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008)
FREE SHIPPING
Released: 1997
Printed boards. Part 4: Rigid multilayer printed boards with interlayer connections. Sectional specification. Section 1: Capability Detail Specification. Performance levels A, B and C
FREE SHIPPING
Released: 2003
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fiberglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
FREE SHIPPING
Released: 2003
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
FREE SHIPPING
Released: 2003
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
FREE SHIPPING
Released: 2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
FREE SHIPPING
Released: 2003
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad