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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN 61760-4 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
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CSN EN 61760-4 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

CSN EN 61760-4

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

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English Hardcopy
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85.55 USD
Category:359310
Released:2015
Number of Standard:CSN EN 61760-4
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EN 61760-4


EN 61760-4 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices - IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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