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Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN 62137-1-1 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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CSN EN 62137-1-1 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

CSN EN 62137-1-1

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

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English Hardcopy
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61.11 USD
Category:359391
Released:2007
Number of Standard:CSN EN 62137-1-1
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EN 62137-1-1


EN 62137-1-1 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test - The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
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