PRICES include / exclude VAT
Homepage>CSN Standards>35 ELECTRICAL ENGINEERING>3593 Surface mounting technology>CSN EN 62137-1-3 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Sponsored link
FREE SHIPPINGReleased: 2009
CSN EN 62137-1-3 - Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

CSN EN 62137-1-3

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Format
Availability
Price and currency
English Hardcopy
In stock
70.00 USD
Category:359391
Released:2009
Number of Standard:CSN EN 62137-1-3
DESCRIPTION

EN 62137-1-3


EN 62137-1-3 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test - The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Original English text of CSN EN Standard.
The price of the Standard included all amendments and correcturs.
Related products
English Hardcopy
In stock
61.11 USD
English Hardcopy
In stock
97.78 USD